MiP stands for Micro LED in Package. It is a packaging process that focuses on new micro LED crystal particles, that is, encapsulating Micro LED chips in micro substrates (such as silicon-based or PCB), which is compatible with existing SMD production lines, greatly reducing the difficulty and cost of Mini LED production (the cost is expected to be reduced by 30% compared with COB soluții) .
Experții din industrie consideră că MIP va servi drept standard al industriei în intervalul P0.2 până la P3.0, conducând tendința pieței
Avantaje de ambalare MIP
Avantaje de ambalare MIP
Compared with traditional COB, SMD and IMD packaging structures, MiP can adapt to smaller line width packaging requirements, and its packaging size can reach less than 60um, which is much smaller than the chip size that can be packaged by other packaging structures. This means that MiP is the only option that can meet the micro LED packaging needs, while other packaging structures are either unachievable or have challenges in reliability and economie .
Scenarii de aplicații: mall-uri de cumpărături ecrane 3D cu ochi liberi, pereți expoziții digitale muzeale, instituții de învățământ interactive blackboard, etc. ., ținând cont de afișarea și economia de înaltă definiție .